Copper plating layer because of its good electrical conductivity, thermal conductivity and mechanical ductility has been widely used in electronic and information products in the field, copper plating technology has also penetrated into the field of electronic materials manufacturing, from the printed circuit board ( PCB ) manufacturing to the IC package, and then to the large scale integrated circuit ( chip ). Copper interconnect technology and other electronic fields are inseparable from it, so the copper plating technology has become a modern microelectronics manufacturing essential electroplating technology of. The electronics industry with very high content of copper plating technology.
With the development of copper plating technology, electroplating waste water hazards has become a modern society can not avoid the problem: the waste of resources and environmental destruction, these issues will be on the electroplating technology of a new challenge. Therefore, for copper electroplating wastewater processing into a crunch time research
In the production process of the printed circuit board, copper plating process is an indispensable link, the resulting copper waste liquid quantity not only, and contains a large number of heavy metal (typically 20g/L ~30 g/L ) and additives. Conventional processing techniques mainly include chemical precipitation, oxidation reduction method, ion exchange method, electrolytic method.
Here, we by electrolytic methods to the reasonable processing copper electroplating waste liquor. The electroplating process plating solution, temperature, pH value, current density, plate spacing, plating time and other factors will have a certain impact on the quality of coating.
Research shows that, through a series of experiments can be informed, in copper plating experiments, using graphite electrode as the anode, cathode copper as, at 25 ℃, the current density is 0.50 A/dm2, electroplating solution of pH = 1.5, the plate distance were 1.5cm, can greatly improve the efficiency of plating.
Research shows that, by electroplating, plating copper cathode by occurrence of hydrogen corrosion bath concentration is 0.08mol/L
Keywords copper electroplating waste water electrolysis hydrogen corrosion influence factors